Zurvahn capabilities span from simple single layer thru-hole boards to complex 16 layer assemblies with BGAs, CSPs, and LCCs for prototypes to mid-volume production.
See below for additional information on specific area and capabilities.
Prototype Manufacturing:
- Complete TPH (thru pin hole) capability
- Complete SMT capability, which includes BGA, Micro BGA, 0201, 0402, Flip Chip, and other types of component placement
- Delivery capabilities include one to five days turn around Weekend build of your prototype
- Provide extensive library of common parts. No need to purchase minimum package quantities of components in our library located on this web site
Local Manufacturing:
- Low to Mid Volume Manufacturing
- SMT, TPH, mixed technology
- Complete SMT capability, which includes BGA, Micro BGA, 0201, 0402, Flip Chip, and other types of component placement. Complete SMT capability, which includes BGA, Micro BGA, 0201, 0402, Flip Chip, and other types of component placement
- Turnkey or consigned material handling
- 2 weeks lead time for manufacturing a consigned kit
- 5 weeks lead time for manufacturing a turnkey kit
Offshore Manufacturing:
- Completely transparent to OEM Factories located in Mainland China
- Program management provided at local Zurvahn facility
- Low to Mid Volume Manufacturing
- Local Zurvahn facility will provide warranty and field return support services
- Complete electro-mechanical, cable, and box build assembly Warehousing and distribution of finished goods